JPS648467B2 - - Google Patents
Info
- Publication number
- JPS648467B2 JPS648467B2 JP58185744A JP18574483A JPS648467B2 JP S648467 B2 JPS648467 B2 JP S648467B2 JP 58185744 A JP58185744 A JP 58185744A JP 18574483 A JP18574483 A JP 18574483A JP S648467 B2 JPS648467 B2 JP S648467B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- adhesive
- semiconductor device
- films
- fluorine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 28
- 239000002313 adhesive film Substances 0.000 claims description 23
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 10
- 229910052731 fluorine Inorganic materials 0.000 claims description 10
- 239000011737 fluorine Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 230000004927 fusion Effects 0.000 claims description 3
- RRZIJNVZMJUGTK-UHFFFAOYSA-N 1,1,2-trifluoro-2-(1,2,2-trifluoroethenoxy)ethene Chemical compound FC(F)=C(F)OC(F)=C(F)F RRZIJNVZMJUGTK-UHFFFAOYSA-N 0.000 claims description 2
- 229920001519 homopolymer Polymers 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 238000007789 sealing Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920000840 ethylene tetrafluoroethylene copolymer Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 polychlorotrifluoroethylene Chemical group 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 1
- 229920006367 Neoflon Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Chemical group 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Chemical group 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58185744A JPS6076146A (ja) | 1983-10-03 | 1983-10-03 | 薄型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58185744A JPS6076146A (ja) | 1983-10-03 | 1983-10-03 | 薄型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6076146A JPS6076146A (ja) | 1985-04-30 |
| JPS648467B2 true JPS648467B2 (en]) | 1989-02-14 |
Family
ID=16176095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58185744A Granted JPS6076146A (ja) | 1983-10-03 | 1983-10-03 | 薄型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6076146A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01141153A (ja) * | 1987-11-26 | 1989-06-02 | Kato Seisakusho:Kk | Ｘ型アウトリガ装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0832492B2 (ja) * | 1988-10-18 | 1996-03-29 | セイコーエプソン株式会社 | Ｉｃカードの製造方法 |
| US6207004B1 (en) | 1996-06-17 | 2001-03-27 | Mitsubishi Denki Kabushiki Kaisha | Method for producing thin IC cards and construction thereof |
| CN1079053C (zh) * | 1996-06-17 | 2002-02-13 | 三菱电机株式会社 | 制造薄ic卡的方法及其结构 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5379379A (en) * | 1976-12-24 | 1978-07-13 | Hitachi Ltd | Production of semiconductor and divice for the same |
| JPS5543871A (en) * | 1978-09-22 | 1980-03-27 | Casio Comput Co Ltd | Packaging of semiconductor device |
| US4293706A (en) * | 1980-06-19 | 1981-10-06 | Ppg Industries, Inc. | Preparation of N-benzyloxycarbonyl aspartic acid |
-
1983
- 1983-10-03 JP JP58185744A patent/JPS6076146A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01141153A (ja) * | 1987-11-26 | 1989-06-02 | Kato Seisakusho:Kk | Ｘ型アウトリガ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6076146A (ja) | 1985-04-30 |
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